碲
掺杂剂
碲化镉光电
铜
氧化铜
图层(电子)
兴奋剂
氧化物
开路电压
材料科学
光电子学
分析化学(期刊)
拓扑(电路)
电压
物理
化学
电气工程
纳米技术
色谱法
工程类
冶金
量子力学
作者
Camden Kasik,Ramesh Pandey,Akash Shah,James Sites
标识
DOI:10.1109/pvsc48317.2022.9938781
摘要
Tellurium oxide $(\mathbf{TeO}_{x})$ was deposited at the back of CdSeTe/CdTe substrates to create a buffer layer to reduce recombination and create a high performing dopant free cell. In these experiments we study the effects $\mathbf{TeO}_{x}$ thickness, $\mathbf{CdCl}_{2}$ treatment, and copper doping have on device performance. Current voltage measurements show efficiencies and open circuit voltages up to 17.5% and 829 mV without the use of copper doping. Furthermore, the TRPL lifetime showed a very significant increase in the absence of copper.
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