材料科学
复合材料
弹性体
热导率
极限抗拉强度
复合数
石墨烯
导电体
原位聚合
聚合
热的
聚合物
纳米技术
物理
气象学
作者
Qian Zhang,Guokang Chen,Kun Wu,Jun Shi,Liyan Liang,Mangeng Lu
摘要
Abstract The booming of modern electronic devices featuring increasing power and multi‐functionalization demands novel high thermal conductive materials with various functions, such as self‐healing property and high deformability, while traditional polymer‐based or metallic‐based materials could hardly provide. Therefore, we report a high thermal conductive and disulfide‐based self‐healable and reprocessible liquid crystalline elastomer (SHLCE) composite by incorporating graphene nanoplates (GNPs) fillers. The obtained GNPs/SHLCE composites exhibited desired thermal conductivity (5.08 Wm −1 K −1 ) when the content of GNPs was 20 wt% to the composites. Moreover, the GNPs/SHLCE composites showed intriguing recycled performance (Tensile strength after recycle could maintain over 93% compared with that of original composites). Furthermore, we concluded that the improved thermal conductivity of GNPs/SHLCE composites was beneficial to the thermal induced reprocessible and shelf‐healable systems.
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