Localized Instabilities of Liquid Metal Films via In‐Plane Recapillarity

This paper describes a simple method to create patterns in thin films of a liquid metal alloy (eutectic gallium indium) using localized electrochemical reduction of the native oxide on the liquid metal surface. This patterning method is similar in spirit to the Etch-a-Sketch toy, but uses capillary withdrawal rather than physical scribing to remove material. As a service to our authors and readers, this journal provides supporting information supplied by the authors. Such materials are peer reviewed and may be re-organized for online delivery, but are not copy-edited or typeset. Technical support issues arising from supporting information (other than missing files) should be addressed to the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.