Direct graphene synthesis on Si(1 0 0) by inductively coupled plasma beam source

石墨烯 材料科学 等离子体 感应耦合等离子体 等离子体原子发射光谱 梁(结构) 电感耦合等离子体质谱法 纳米技术 化学 物理 光学 质谱法 核物理学 色谱法
作者
Šarūnas Meškinis,Andrius Vasiliauskas,Rimantas Gudaitis,Mindaugas Andrulevičius,Asta Guobienė
出处
期刊:Applied Surface Science [Elsevier]
卷期号:580: 152265-152265 被引量:4
标识
DOI:10.1016/j.apsusc.2021.152265
摘要

• The graphene was grown on the Si(1 0 0) by an Inductively Coupled Plasma Beam Source. • Boundary defects dominated in most samples due to the polycrystallinity of graphene. • In some samples, on-site defects prevailed due to the hydrogenation of graphene. • The synthesis conditions should be optimized to avoid out-of-plane graphene growth. • The line-of-sight graphene deposition on Si(1 0 0) was demonstrated. The graphene was synthesized directly on the Si(1 0 0) substrate by an Inductively Coupled Plasma Beam Source without any catalyst. Plasma power, methane gas flow, hydrogen gas flow, temperature and time effects on graphene layers number and flake size, defects density, and surface morphology were studied. Prevailing defects type was considered. Boundary defects dominated in most samples due to the polycrystalline nature of the directly synthesized graphene. However, high methane gas flows, low synthesis times, and low synthesis temperatures were beneficial for the hydrogenation of the growing graphene. On-site defects prevailed in these samples. It was found that synthesis power, temperature, and time should be optimized to avoid out-of-plane graphene growth. An additional hydrogen gas flow effectively controlled graphene layers number. D + D‘ and D + D“ peaks were explored. It was supposed that the D + D‘ peak is mainly related to the on-site defects associated with a hydrogen atom bonded to the carbon atom in the graphene sheet. The line-of-sight graphene deposition was demonstrated. The main graphene growth-related physical and chemical processes were considered. The observed results were explained by a competition between graphene growth, hydrogen etching, hydrogenation, and thermal stress release.
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