材料科学
热导率
石墨烯
复合材料
导电体
小型化
热传导
热的
聚合物
填料(材料)
数码产品
导电聚合物
纳米技术
电气工程
气象学
工程类
物理
作者
An Li,Cong Zhang,Yangfei Zhang
出处
期刊:Polymers
[Multidisciplinary Digital Publishing Institute]
日期:2017-09-15
卷期号:9 (9): 437-437
被引量:400
摘要
With the integration and miniaturization of electronic devices, thermal management has become a crucial issue that strongly affects their performance, reliability, and lifetime. One of the current interests in polymer-based composites is thermal conductive composites that dissipate the thermal energy produced by electronic, optoelectronic, and photonic devices and systems. Ultrahigh thermal conductivity makes graphene the most promising filler for thermal conductive composites. This article reviews the mechanisms of thermal conduction, the recent advances, and the influencing factors on graphene-polymer composites (GPC). In the end, we also discuss the applications of GPC in thermal engineering. This article summarizes the research on graphene-polymer thermal conductive composites in recent years and provides guidance on the preparation of composites with high thermal conductivity.
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