Parameters estimation of SPICE models for silicon carbide devices
作者
Damian Bisewski
标识
DOI:10.23919/empc.2017.8346918
摘要
The paper deals with the problem of parameters estimation of built-in in SPICE models of semiconductor devices. A new parameters estimation procedure based on the genetic algorithm is proposed and discussed. The usefulness and accuracy of presented procedure are illustrated by means of the results of measurements and SPICE models simulations for selected semiconductor devices made of silicon carbide.