氢氟酸
蚀刻(微加工)
碳化硅
硅
化学
微电子
各向同性腐蚀
氧化物
化学计量学
缓冲氧化物腐蚀
无机化学
纳米技术
化学工程
图层(电子)
表面改性
表面能
反应离子刻蚀
材料科学
有机化学
物理化学
工程类
作者
Sarit Dhar,Oliver Seitz,Mathew D. Halls,Sungho Choi,Yves J. Chabal,L. C. Feldman
摘要
Hydrogen termination of oxidized silicon in hydrofluoric acid results from an etching process that is now well understood and accepted. This surface has become a standard for studies of surface science and an important component in silicon device processing for microelectronics, energy, and sensor applications. The present work shows that HF etching of oxidized silicon carbide (SiC) leads to a very different surface termination, whether the surface is carbon or silicon terminated. Specifically, the silicon carbide surfaces are hydrophilic with hydroxyl termination, resulting from the inability of HF to remove the last oxygen layer at the oxide/SiC interface. The final surface chemistry and stability critically depend on the crystal face and surface stoichiometry. These surface properties affect the ability to chemically functionalize the surface and therefore impact how SiC can be used for biomedical applications.
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