Nano-Grooving on Copper by Nano-Milling and Nano-Cutting
作者
Dandan Cui,Kausala Mylvaganam,Liang Chi Zhang
出处
期刊:Advanced Materials Research [Trans Tech Publications] 日期:2011-08-22卷期号:325: 576-581被引量:12
标识
DOI:10.4028/www.scientific.net/amr.325.576
摘要
This paper uses the molecular dynamics simulation to investigate the quality of nano-scale grooving on mono-crystalline copper by high-speed nano-milling and nano-cutting. The results reveal that nano-milling produces a high-quality nano-groove with smooth surfaces in comparison with a nano-cutting. It is also interesting to note that the machined workpiece subsurface can be free from dislocations.