Synthesis and Characterization of Photosensitive Polyimides for Optical Applications

单体 高分子化学 甲基丙烯酸酯 低聚物 聚酰亚胺 酰亚胺 光敏性 材料科学 聚合物 聚合 热稳定性 光致聚合物 甲基丙烯酸甲酯 化学 有机化学 图层(电子) 复合材料 光电子学
作者
Kye-Hyun Kim,Seyoung Jang,Frank W. Harris
出处
期刊:Macromolecules [American Chemical Society]
卷期号:34 (26): 8925-8933 被引量:41
标识
DOI:10.1021/ma011072t
摘要

The objective of this research was to prepare colorless photosensitive polyimides for optical applications. In the first approach to these materials two new photosensitive end-capping agents, i.e., 6-(4-aminophenoxy)hexyl methacrylate and di[2-(methacryloyloxyethyl)] 5-aminoisophthalate, for polyimides were prepared. These agents were used along with 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl to prepare a series of methacrylate end-capped imide oligomers. However, the oligomers required long exposures to UV radiation to affect cure. To improve their photosensitivity, multifunctional additives and photoinitiators were used. A tetrafunctional end-capped oligomer that contained 10 wt % trimethylolpropane triacrylate and 5 wt % trimethylbenzoyldiphenyl phosphine oxide (TMDPO) was photosensitive and displayed good photopatterning properties. A second approach to the desired materials involved the synthesis of a diamine monomer, i.e., 2,2'-dimethacryloyloxy-4,4'-diaminobiphenyl, in which methacrylate moieties were attached to the 2- and 2'-positions of a biphenyl structure. The monomer was polymerized with commercially available dianhydrides such as 6FDA and 4,4'-oxydiphthalic anhydride. The polyimides obtained were soluble in common organic solvents such as THF, acetone, and chloroform and could be solution cast into thin, water-white films that were highly transparent in the visible light region. The polymers were photosensitive when combined with 5 wt % TMDPO and displayed good photopatterning properties. The polymers, which afforded line patterns 10−30 μm wide and 5−20 μm thick, did not develop color or shrink during UV exposure and subsequent thermal treatments.
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