材料科学
复合材料
导电体
复合数
铜
电阻率和电导率
芯(光纤)
承重
压力(语言学)
电导率
纳米复合材料
限制
工作(物理)
多核处理器
纳米尺度
基质(化学分析)
纳米
有限元法
断裂(地质)
作者
Wenqing Dai,Yongfeng Geng,Shiyu He,Xiaohui Zhang,Ding-Bang Xiong
标识
DOI:10.1080/21663831.2026.2617410
摘要
Copper matrix composites face the inherent strength-conductivity trade-off, limiting their high-end applications. Inspired by bone and bamboo, a bioinspired oriented multicore composite (BOMC) was fabricated. Its dual-network system, fabricated via self-assembly and cutting-recombination, consists of one for load bearing (DIGFs/Cu subunits) and one for electron transport (DIGFs and Cu sleeves). This design achieves an unprecedented synergy. DIGFs/Cu subunits achieve mechanical strengthening through high-density dislocations and stress distribution, while pure copper paths and conductive DIGFs ensure high conductivity. This work effectively alleviates the performance trade-offs and provides a strategy for hierarchical structure design.
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