Transfer Two‐Dimensional Materials via Analyzing Receive and Give Process

Abstract Two‐dimensional (2D) materials have attracted considerable research interest and widespread application due to their unique electrical, optical, and mechanical properties, which arise from their atomic‐scale thickness. Devices based on 2D materials have found extensive applications in fields like optoelectronics, sensing, and energy storage. Notably, TMDCs exhibit tunable bandgaps depending on the number of layers, along with inter‐valley spin coupling, which further broadens their potential applications. Although significant progress has been made in recent years in direct growth approaches such as chemical vapor deposition (CVD), physical vapor deposition (PVD), and atomic layer deposition (ALD), the extreme physical and chemical conditions required during these processes often lead to damage, which can hinder detailed investigations and limit the exploration of their full potential. As a result, various transfer methods have been developed to transfer 2D materials from the growth substrate to the target substrate. These methods, which enable the fabrication of devices with outstanding performance through heterogeneous integration, have garnered significant attention. Therefore, this review focuses on the processes involved in various transfer methods, evaluating each method based on the receiving and giving stages. Furthermore, it employs this evaluation framework to compare different transfer methods and analyze their applicability to various types of 2D materials.