空位缺陷
化学计量学
催化作用
密度泛函理论
活化能
吸附
硅
材料科学
物理化学
结晶学
计算化学
化学
冶金
有机化学
作者
Huhu Wang,Qing Zheng,Yi Wang,Yuwen Ji,Wencai Peng,Jinli Zhang,Jianshu Zhang,Jichang Liu
标识
DOI:10.1002/slct.202202818
摘要
Abstract In this paper, the effect of Cu vacancy of Cu 3 Si(001) surface for the hydrogenation of silicon tetrachloride was systematically studied by density functional theory (DFT). The favorable adsorption sites and stable configurations of reaction species are obtained and three possible reaction paths of SiHCl 3 formation were achieved by transition state search. For the perfect Cu 3 Si(001) surface(P), Path1 is the most favorable, with a reaction barrier of 158.15 kJ mol −1 . For both the single Cu‐vacancy(SV) and double Cu‐vacancy Cu 3 Si(001) surface(DV), Path2 is the most favorable, with the reaction barriers of 130.07 kJ mol −1 and 124.81 kJ mol −1 , respectively. The results reflect that the activation energy of the reaction decreased significantly with the increase of Cu‐vacancy on the Cu 3 Si(001) surface, which may be the reason for the higher catalytic activity of Cu 3 Si catalysts with smaller Cu−Si stoichiometric ratios. This study can provide a reasonable explanation for previously experimental observation and provide a guidance for future catalyst design.
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