Preparation and properties of thermally conductive polyimide/boron nitride composites

Hexagonal boron nitride micro particles functionalized by γ-MPS, were used to fabricate PI/BN composites. The thermal conductivity of the composites with 40 wt% m-BN content was increased to 0.748 W m⁻¹ K⁻¹, 4.5 times higher than that of the pure PI.