薄脆饼
受器
材料科学
蚀刻(微加工)
温度控制
半导体器件制造
温度测量
体积热力学
光电子学
过程(计算)
半导体
计算机科学
汽车工程
机械工程
工程类
纳米技术
物理
外延
图层(电子)
量子力学
操作系统
作者
Jaehwan Kim,Yoonsung Koo,Wansoo Song,Sang Jeen Hong
出处
期刊:Electronics
[Multidisciplinary Digital Publishing Institute]
日期:2022-03-10
卷期号:11 (6): 880-880
被引量:11
标识
DOI:10.3390/electronics11060880
摘要
The temperature of electrostatic chuck (ESC), a wafer susceptor used in semiconductor etch equipment, must accurately control the temperature of wafers during the etching process to obtain uniform and consistent process results. Failure to control the precise temperature can lead to rejection from the high-volume semiconductor manufacturing site (one of the most high-cost equipment components which can be repaired for its extended use). In this research, we propose a wireless-type on-wafer temperature monitoring system (OTMS) for easier and faster temperature monitoring to help temperature measurements of the repaired ESC in atmospheric and vacuum conditions. The proposed method, which can effectively measure the temperature distribution of the ESC, should manage the operational condition of ESC. A successful demonstration of the 300 mm size OTMS for the repaired parts enhanced the quality assurance with a temperature deviation of ±3.83 °C over 65 points of measurement.
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