抛光
材料科学
微晶
钇
表面粗糙度
化学机械平面化
陶瓷
薄脆饼
单晶
复合材料
衍射
泥浆
冶金
光学
光电子学
结晶学
化学
物理
氧化物
作者
Jeffrey McKay,Tingyu Bai,Mark S. Goorsky
出处
期刊:ECS transactions
[The Electrochemical Society]
日期:2014-08-14
卷期号:64 (5): 397-402
被引量:2
标识
DOI:10.1149/06405.0397ecst
摘要
Processes for chemical mechanical polishing of yttrium aluminum garnet (YAG) and yttria (Y 2 O 3 ) using commercial slurries have been developed for subsequent bonding applications. Single crystal and polycrystalline surfaces are polished to below 0.5 nm RMS surface roughness, with a controllable polishing rate of 0.3 nm / min. In addition, high resolution x-ray diffraction measurements show a reduction of subsurface damage after polishing these commercially available substrates. Surfaces are generated with < 0.5 nm RMS surface roughness are suitable for wafer bonding, and are treated with various surface preparation steps prior to bonding. Once bonded at room temperature, samples are heated at 1425° C for 72 hours to further strengthen the bond.
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