Research of manufacture of high resin Prepreg used in thick copper printed circuit board

Generally,the higher Resin Content of 106 prepreg(pp) is just about 75%.The clearances between the circuitries of thick copper(more than 3 oz,including 3 oz) printed circuit board need much more resin to fill.So,the prepreg which is manufactured by normal process is difficult to fill the thick copper printed circuit board very well.So this article is set to research new method of process of increasing resin content of prepreg,and improve the filling resin capacity of the prepreg to the thick copper printed circuit board.