Void-free and Lead-free Soldering of BGA With Vacuum Reflow Soldering

Voids are usually formed in the solder joints after the soldering of BGA.Because of higher soldering temperature,serious oxidation and the special characters of lead-free solder,voids are formed easily for the lead-free soldering of BGA.BGA voids in the solder joints not only influence the electrical and thermal function,but also influence the mechanical robustness.They also influence greatly the long life reliability of BGA.Analyze the mechanism of void formation,and introduces the void-free and lead-free soldering of BGA with vacuum reflow soldering technology.Vacuum reflow soldering technology is a valid technology for the void-free and lead-free soldering of BGA.