Based on mixed-mode transient analyses utilizing a 2-dimensional device simulator, we have suggested the methodology to analyze the HBM ESD phenomena in CMOS chips utilizing NMOS transistors for ESD protection, and have analyzes the HBM discharge mechanisms in detail. Also the second breakdown characteristics in the protection device have been successfully simulated based on mixed-mode simulations, to explain the discharge mechanisms leading to device failure. To analyze the effects of the device structure changes on the discharge characteristics, we have compared the results of DC analyses and mixed-mode transient analyses, and have discussed about more robust designs of NMOS transistor structures against HBM ESD based on the analyses.