Effect of Temperature on Structure and Properties of Tungsten layer Fabricated by Chemical Vapor Deposition

Tungsten layer deposited in copper substrate had been fabricated by chemical vapor deposition (CVD), using WF6 and H2. With the increasing of the deposition temperature, the microstructure of the layer was changed from columnar grains to dendritic grains, meanwhile density and hardness of deposition layer was decreased, the surface roughness got worse and wearing resistance was decreased. The optimal deposition temperature of CVD tungsten layer is 550～650 ℃.