Evaluation of Electrophoretically Deposited CuMn1.8O4 Spinel Coatings On Metallic Interconnects for SOFC Applications

Dense and well-adhered CuMn1.8O4 spinel coatings were deposited on Crofer 22 APU substrates by electrophroetic deposition (EPD). The coatings led to a significant reduction in the oxidation rate of the stainless steel compared to the uncoated steel at 800{degree sign}C in air and showed no diffusion of Cr from the alloy into the coating. A diffusion model was developed to calculate the effective diffusivities through the coating and thermally grown oxide. These values were calculated to be 2X10-15 cm2/s and 2.5X10-16 cm2/s, respectively. The as-processed coated sample exhibited only 4.6 mΩ cm2 ASR at 800{degree sign}C.