3D-printing and electronic packaging - current status and future challenges

作者
C. Bailey,Stoyan Stoyanov,Timothy Tilford,Georgios Tourloukis
出处
期刊: 卷期号:: 1-4 被引量:10
标识
DOI:10.1109/eptc.2016.7887895
摘要

3D-Printing, or Additive Manufacturing, has received significant media attention during the last five years. A number of companies are now commercializing materials, design tools, and 3D-Printers and these are being used in a number of sectors for digital manufacturing including aerospace, medical, construction and consumer products. But what impact is 3D-Printing having on electronic packaging and manufacturing? Companies that produce and sell 3D-Printers as well as EDA and MCAD companies are now promoting 3D-Printing towards the electronics sector. This paper details the current status of 3D-printing for the manufacture and packaging of electronic systems, and provides some insights on how it may impact our community in the future. Challenges related to the performance and electrical behavior of printed conductive materials are discussed as they must meet or better the performance of materials currently used. And of course the overall quality and reliability of any 3D-printed electronic system must meet industry requirements. The paper will detail developments taking place in design and modelling tools and how these can be used in addressing some of these challenges.

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