环氧树脂
材料科学
纳米复合材料
复合材料
氮化硼
球磨机
热稳定性
硅烷
玻璃化转变
聚合物
化学工程
工程类
作者
Bolin Tang,Miao Cao,Yaru Yang,Jipeng Guan,Yongbo Yao,Jie Yi,Jun Dong,Tianle Wang,Luxiang Wang
出处
期刊:Polymers
[MDPI AG]
日期:2023-03-13
卷期号:15 (6): 1415-1415
被引量:13
标识
DOI:10.3390/polym15061415
摘要
In this work, KH550 (γ-aminopropyl triethoxy silane)-modified hexagonal boron nitride (BN) nanofillers were synthesized through a one-step ball-milling route. Results show that the KH550-modified BN nanofillers synthesized by one-step ball-milling (BM@KH550-BN) exhibit excellent dispersion stability and a high yield of BN nanosheets. Using BM@KH550-BN as fillers for epoxy resin, the thermal conductivity of epoxy nanocomposites increased by 195.7% at 10 wt%, compared to neat epoxy resin. Simultaneously, the storage modulus and glass transition temperature (Tg) of the BM@KH550-BN/epoxy nanocomposite at 10 wt% also increased by 35.6% and 12.4 °C, respectively. The data calculated from the dynamical mechanical analysis show that the BM@KH550-BN nanofillers have a better filler effectiveness and a higher volume fraction of constrained region. The morphology of the fracture surface of the epoxy nanocomposites indicate that the BM@KH550-BN presents a uniform distribution in the epoxy matrix even at 10 wt%. This work guides the convenient preparation of high thermally conductive BN nanofillers, presenting a great application potential in the field of thermally conductive epoxy nanocomposites, which will promote the development of electronic packaging materials.
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