Plasma Descum on Advanced Packaging Development

In this study, we have established an automated descum process, and based on MicroWave (MW) plasma system for VIPack advanced semiconductor packaging on underfill treatment process. When the plasma is working, a glow is produced inside the chamber. Experimental results are measured by applying the contact angle method to the treated substrate. The descum process is carried out under optimal chamber vacuum. This experimental result proves that the radio frequency system can ensure that the substrate stably reaches hydrophilic quality during the plasma descum process and can be applied to VIPack advanced packaging.