Microstructure and Mechanical Behavior of Cu–Al–Ag Shape Memory Alloys Processed by Accumulative Roll Bonding and Subsequent Annealing

Ultrafine-grained Cu/Al/Ag composites were processed by an accumulative roll bonding (ARB) technique from pure copper and aluminum sheets and a silver powder. The Al content was fixed to 11 wt.% while the silver concentration was 1, 2, or 3 in wt.%. The ARB-processed samples were heat treated at different temperatures between 750 and 1050 °C for 60 min and then quenched to room temperature (RT) for producing Cu–Al–Ag alloys. The effect of the addition of different Ag contents and various heat treatment temperatures on the structural evolution was investigated. The ARB-processed samples were composed of Cu and Al layers with high dislocation density and fine grain size (a few microns). During heat treatment of the ARB-processed samples, new intermetallic phases formed. For the lowest Ag content (1 wt.%), the main phase was a brittle simple cubic Al4Cu9, while for higher Ag concentrations (2 and 3 wt.%), the quenched samples contain mainly an orthorhombic β1-AlCu3 martensite phase. The martensite phase consisted of very fine lamellas with a thickness of one micron or less. The heat treatment increased the microhardness and the strength of the samples at RT due to the formation of a fine-grained hard martensite phase. For 2 and 3% Ag, the highest martensite phase content was achieved at 850 and 950 °C, respectively. The annealed and quenched samples exhibited good shape memory behavior at RT.