材料科学
光电子学
二极管
平面的
硼
电压
限制
击穿电压
宽禁带半导体
铝
扩散
电气工程
复合材料
工程类
计算机科学
物理
机械工程
热力学
计算机图形学(图像)
核物理学
作者
H Onose,S. Oikawa,Tsutomu Yatsuo,Yutaka Kobayashi
标识
DOI:10.1109/ispsd.2000.856817
摘要
The Field Limiting Ring (FLR) termination structures are examined in order to confirm the high voltage technology of SiC diodes and FETs. Elemental devices with planar FLR terminations are fabricated and their reverse I-V characteristics are determined using 4H n-type SiC. First demonstrations of breakdown voltages higher than 2000 V are succeeded by using FLR terminations. Optimal FLR spacing of the boron termination is wider than that of the aluminum case. This difference is considered to show that the lateral diffusion is remarkable for the process using boron implantation.
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