High-density IC Packaging Based on Flexible Printed Circuit

In recent years,with rapid development,the FPC technology is being used in more fields. And the most attractive application is in the IC packaging,which promotes miniaturization,light weighed and high performance of the electronic device. In this paper,the technical process,key technology,application situation and development prospect of CSP packaging on flexible substrate and COF(chip on film)packaging and stacked package of the flexible carrier are introduced in the paper. It’s fully proved that the flexible printed circuit and the high-density interconnect apply to IC packaging. IC packaging technique based on the FPC will keep developing at top speed,and especially the flexible stacked SIP packaging technology has wide application prospects.