材料科学
聚酰亚胺
电介质
聚合物
光电子学
电容感应
工作(物理)
联轴节(管道)
三嗪
储能
电容
电场
电容耦合
高能
能量(信号处理)
互连
纳米技术
介电损耗
驻极体
工程物理
作者
Xi Chen,Hang Luo,Guanghu He,Deng Hu,Fan Wang,Xiaona Li,Zhongna Yan,Dou Zhang
摘要
ABSTRACT Polymer dielectrics operating under extreme environments require increasingly higher demands on electrical insulation performance. Polyimide (PI), one of the most promising candidates for high‐temperature energy‐storage dielectrics, tends to form charge‐transfer complexes (CTCs) under high temperatures and high electric fields, which promotes carrier migration and increases dielectric loss. In this work, by introducing 3,9‐Bis[2‐(3,5‐diamino‐2,4,6‐triazaphenyl) ethyl]‐2,4,8,10‐tetraoxaspiro[5.5]undecane (DTI) into semi‐aromatic polyimide (SPI), a topology‐regulated SPI‐co‐DTI network was constructed. The electron‐deficient triazine units in DTI can induce local electrostatic‐potential heterogeneity and polarized transport barriers. The helical configuration of DTI further disrupts the continuity of interchain coupling and blocks charge‐transport pathways. SPI‐co‐0.5%DTI achieves a discharged energy density ( U d ) of 8.79 J cm −3 with an efficiency ( η ) above 90% at 150°C and 780 kV mm −1 . At 200°C, SPI‐co‐0.5%DTI still maintains a high U d of 5.93 J cm −3 , which is 103% higher than that of SPI at the same conditions. This work provides a new design concept and paradigm for developing high‐performance polymer dielectrics for harsh‐environment applications.
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