Nitrous Oxide-Plasma Silicon Oxide Coupled with Carbon-Incorporated Polycrystalline Silicon Enables Highly Passivated TOPCon Solar Cells

材料科学 钝化 硅 非晶硅 光电子学 多晶硅 纳米晶硅 退火(玻璃) 单晶硅 氧化物 形成气体 晶体硅 太阳能电池 化学工程 氧化硅 载流子寿命 图层(电子) 微晶 氢 基质(水族馆) 无定形固体 碳纤维 纳米技术 薄脆饼 带隙
作者
Zunke Liu,Ruoyi Wang,Na Lin,Hongkai Zhou,Xukai Zhao,Wen Lei,Xi Zhang,Hailong Zhang,Sheshicheng Chen,Haojiang Du,Mingdun Liao,Wei Liu,Xiaomin Yang,Zhiqin Ying,Zhenhai Yang,Yuheng Zeng,J P Ye
出处
期刊:ACS Applied Materials & Interfaces [American Chemical Society]
卷期号:18 (22): 31530-31541
标识
DOI:10.1021/acsami.6c06122
摘要

Tunnel oxide passivated contact (TOPCon) solar cells have become the industrial mainstream for high-efficiency crystalline silicon photovoltaics. Further efficiency gains critically depend on achieving ultrahigh passivation performance while maintaining full industrial compatibility. However, achieving highly passivated TOPCon through the synergy of chemical and electric field-effect passivation remains challenging, because simultaneously obtaining high-quality interfacial SiO x and poly-Si films along with a suitable phosphorus-diffusion profile in the silicon substrate is difficult. In this study, we develop a highly passivated TOPCon structure featuring an ultrathin silicon oxide (SiO x ) layer prepared via N 2 O plasma oxidation combined with a carbon-incorporated polycrystalline silicon (poly-Si) layer, resulting in a synergistic improvement in both chemical and field-effect passivation. Notably, a uniform, continuous, and amorphous ultrathin SiO x film provides high chemical passivation, whereas the introduction of carbon into poly-Si suppresses poly-Si crystallization, increases hydrogen accumulation at the SiO x /silicon interface, reduces the poly-Si work function, and forms favorable energy band bending, collectively contributing to superior passivation performance. As a result, the optimized TOPCon structure not only exhibits high tolerance to annealing temperature and carbon content but also achieves excellent passivation, with an implied open-circuit voltage ( iV oc ) of 760 mV, an ultralow recombination current density ( J 0,s ) of 0.5 fA/cm 2, and a minority carrier lifetime ( τ eff ) of 27.9 ms. Industrial validation shows an absolute efficiency gain of 0.05% in mass-produced large-area TOPCon cells, confirming the scalability and effectiveness of this TOPCon structure.
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