加密
灰度
计算机科学
可扩展性
解码方法
物理不可克隆功能
编码(内存)
认证(法律)
计算机硬件
密码学
灵活性(工程)
计算机数据存储
人工智能
维数(图论)
嵌入
平面的
数据提取
计算机视觉
材料科学
平版印刷术
鉴定(生物学)
信息敏感性
模式识别(心理学)
信息隐藏
作者
Yu Chen,Junhu Cai,Wenzong Lai,Huilong Yang,Zheng Zhou,Yun Ye,Sheng Xu,Tailiang Guo,Enguo Chen
标识
DOI:10.1002/adfm.202529742
摘要
ABSTRACT State‐of‐the‐art anti‐counterfeiting technologies are transitioning from planar 2D labels to volumetric 3D architectures. Embedding encrypted data in the labels adds a hidden information dimension accessible only with specific keys or designated readout protocols. However, most reported 3D anti‐counterfeiting patterns are implemented as multi‐layer stacks and lack cryptographic capability, while reliance on specialized equipment further limits scalability and broad adoption. Herein, we propose a synergistic strategy for information encryption and anti‐counterfeiting through integrated encoding and authentication mechanisms. Quantum dot (QD) patterns are created through single‐step grayscale lithography, where encrypted information is directly embedded into the 3D structure. The resulting structure incorporates a randomized physical unclonable function (PUF), conferring inherent and unforgeable uniqueness. Artificial intelligence (AI) is employed for anti‐counterfeiting recognition and authentication, while 3D topography scanning enables accurate decoding and reconstruction of the encrypted information. This approach integrates high design flexibility with rapid patterning, enabling 5 mm × 5 mm 3D QD patterns to be fabricated within 5 min. The patterns are proven to retain fluorescence and authentication accuracy after more than 6 months of storage without additional encapsulation. The method is highly compatible with existing micro/nanolithography processes, paving the way for low‐cost, high‐throughput fabrication of 3D QD structures.
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