微电子
航空航天
材料科学
纳米技术
环氧树脂
数码产品
系统工程
动力传输
研究开发
电子材料
领域(数学)
过程(计算)
电介质
表征(材料科学)
工程物理
计算机科学
串扰
过程开发
制造工程
工艺工程
新产品开发
新兴技术
基础研究
技术开发
电子设备
机械工程
材料加工
航空航天材料
聚合物
应用研究
作者
Longtao Wang,Haoyang Jin,Fengyuan Zhang,Songqi Ma
标识
DOI:10.1021/acsami.5c24084
摘要
With the rapid advancement of microelectronics technology and artificial intelligence, electronic devices are undergoing rapid evolution toward high integration, miniaturization, and multifunctionality. However, this development trend has also brought about a series of technical challenges, such as signal transmission delay, crosstalk interference, and increased power consumption. Against this backdrop, the research and development of low-dielectric constant materials hold significant strategic importance. Particularly, the demand for high-performance low-dielectric resins has become particularly urgent with rapid development of high-speed and high-frequency electronic devices. Low-dielectric resins exhibit important application values in multiple key fields owing to their unique performance advantages. This paper systematically reviews the main types of low-dielectric resins, focusing on the research progress of traditional materials such as epoxy resins, polyimides, liquid crystal polymers, and other low-dielectric polymers. By deeply analyzing their dielectric property regulation mechanisms and preparation process optimization strategies, this paper elaborates on the practical applications of these materials in modern electronic devices, communication systems, aerospace equipment, defense technology, and energy technologies. Based on systematic research from molecular structure design to macroperformance optimization, this paper summarizes the latest research achievements in this field and prospects the future development directions, aiming to provide theoretical foundations and technical references for material research and development as well as engineering applications in related fields.
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