P‐12.8: A new type of flexible process structure with smaller bending radius of 10mask

With the development of display technology, flexible displays are favored by consumers due to their narrower bezels and thinner profiles. Generally, the down border of a flexible display requires a bending area to fold the COP (Chip on Plastic) to the back of the screen. With the further demand for fewer manufacturing processes and smaller bending radius, the bending area may have metal residue, which can lead to metal short circuits and the risk of metal wire breakage due to bending cracks. We have researched a new process flow using a 10‐mask process with a bending radius of about 0.2mm. In the bending area, there is no metal signal disconnection, and it has passed the reliability tests.