Air-immersion solution, maximizing Data Centers heat reuse, using hybrid cooling approach combining two-Phase direct on chip dielectric liquid and air-based chip cooling

The rapid growth of data center power consumption requires moving to a more sustainable operation, with higher efficiency and a minimal carbon footprint. Liquid based cooling systems tend to increase efficiency, compared to air based cooling systems, and have the potential to decrease carbon footprint by enabling a more efficient heat reuse. For maximizing heat reuse, the outlet water temperature should be as high as possible with as little as possible, heat being released to the ambient.In this work, we examined the outlet water temperature when using a 2-phase direct on chip dielectric liquid, as well as the amount of heat capture when combining the said cooling method with air immersion created by a closed loop active rear door heat exchanger. The results indicated an outlet water temperature of 60-70℃ and a heat capture of 100% with a reduction in cooling power compering to an air-based cooling system.This paper will suggest a new approach to datacenters thermal management that will promote a more efficient and sustainable operation of data centers.