等离子体
光电子学
材料科学
等离子体化学
蚀刻(微加工)
等离子体刻蚀
计算机科学
纳米技术
物理
图层(电子)
量子力学
作者
Z.-S Wang,Chun‐Xiang Guo,Jian Liu,Yingxiong Feng,Lulu Guan,Kangning Xu,Qiao Huang,Lu Chen,Kaidong Xu
标识
DOI:10.1109/cstic58779.2023.10219159
摘要
High breakdown voltages, high electron mobility and saturation velocity of gallium nitride (GaN) make it suitable for high frequency, high voltage, high temperature and high efficiency applications. Plasma dry etch is one of the key device manufacturing processes which played an important role in advanced GaN technology development. Partnered with several GaN device research institutes, IDMs and foundries, Leuven Instruments has been continuously accelerating tool hardware/function design cycle to fulfill the device manufacturing requirement, improving tool robustness, enhancing tool process capabilities. We’ve successfully developed a full GaN dry etching solutions from well-tuned anisotropic profile and smooth etching sidewall/surface control to minimize or even eliminate surface damage by low power & ALE technique. Leuven Instruments could provide an integrated plasma dry etching solutions to our customer in support various GaN technology development.
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