放电等离子烧结
挤压
材料科学
合金
冶金
固态
等离子体
烧结
SPARK(编程语言)
模具(集成电路)
工程物理
纳米技术
计算机科学
工程类
程序设计语言
物理
量子力学
作者
Ye Wang,Xiuyu Gao,Bo Jiang,Dongdong Zhu,Maoliang Hu Hu,Wentao Jiang
标识
DOI:10.31577/km.2023.4.267
摘要
To investigate the low-cost and short-process recycling technologies for aluminium alloys, recycled chip-based Al-Si-Cu-Fe alloys were fabricated by spark plasma sintering (SPS) and hot extrusion.Microstructural observations by optical microscopy and scanning electron microscopy indicated that the recycled alloys could achieve good metallurgical bonding between the chips by fragmenting the alumina films on the chip surface by spark plasma sintering and hot extrusion after hot compress.The hot extruded recycled alloy has a smaller matrix grain size and second phase size than that of spark plasma sintered recycled alloys, due to the dynamic recrystallization and fragmentation of strong plastic deformation that occurs during the hot extrusion process.As a result, the chip-based Al-Si-Cu-Fe alloy recycled by hot extrusion after hot compress exhibited the best mechanical properties, with ultimate tensile strength, yield strength, and elongation of 258 and 132 MPa, and 8.6 % than that recycled by spark plasma sintering because of the effective metallurgical bonding between the chips, refinement of matrix grains, fragmentation and dispersion reinforcement of the oxide film and the second phase.K e y w o r d s : Al-Si alloy, microstructure,
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