二硒化钨
量子隧道
材料科学
光电子学
接触电阻
单层
肖特基势垒
异质结
晶体管
双极扩散
二硫化钼
工作职能
纳米电子学
载流子
二硫化钨
场效应晶体管
钝化
电极
钨
过渡金属
纳米技术
偶极子
肖特基二极管
电子迁移率
MOSFET
覆盖层
电接点
凝聚态物理
电荷(物理)
矩形势垒
共发射极
作者
Amirhossein Nazarian‐Firouzabadi,Inayat Uddin,Nhat Anh Nguyen Phan,Mahfuz Alam Khan,Gil‐Ho Kim
标识
DOI:10.1002/admt.202501813
摘要
ABSTRACT High contact resistance at the metal‐semiconductor interface remains a critical bottleneck in achieving high‐performance field‐effect transistors based on 2D transition metal dichalcogenides, particularly ambipolar tungsten diselenide (WSe 2 ). Here, we demonstrate a novel tunneling contact architecture using monolayer molybdenum disulfide (MoS 2 ) inserted between Cr electrodes and few‐layer WSe 2 channels. The MoS 2 /WSe 2 tunneling contact device exhibits significantly improved charge injection characteristics compared to conventional surface contacts, as revealed by output characteristics, Schottky barrier height (SBH) analysis, and transport measurements across temperature. The MoS 2 tunneling contact configuration reduces SBH to 43.34 meV for holes and 1.2 meV for electrons, enabling efficient direct tunneling in the p‐type and n‐type regimes, respectively. These enhancements are attributed to dipole formation at the interface and suppression of deep‐state pinning. Field‐effect mobility measurements show over 50 times improvement in the p‐type regime and 3 times in the n‐type regime, while achieving more than two orders of magnitude reduction in contact resistance. This work establishes MoS 2 ‐tunneled heterostructure contacts as a scalable and effective strategy for realizing ambipolar, low‐resistance, and high‐mobility 2D electronics.
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