Thermodynamic properties and transport coefficients in SF6-Cu mixtures at temperatures of 300-30000 K and pressures of 0.1-1 MPa

The thermodynamic properties and the transport coefficients of thermal plasmas formed in SF 6 -copper vapour mixtures were calculated as a function of temperature and pressure for molar concentrations of copper between 0 and 10%. The material property that is most affected by the presence of copper is the electrical conductivity for temperatures up to 10000 K. The results given in this paper enabled a data bank to be built up for modelling arcs in SF 6 seeded with copper vapour.