硫黄
铜
催化作用
氧气
掺杂剂
欠电位沉积
金属
石墨
化学
无机化学
氮气
沉积(地质)
化学工程
材料科学
电化学
兴奋剂
冶金
循环伏安法
电极
有机化学
古生物学
物理化学
生物
沉积物
光电子学
工程类
作者
Jingsong Xu,Rui Li,Rongguang Zeng,Yingru Li,Qifa Pan,Hang Zhong,Jun Chen
标识
DOI:10.1002/celc.201901546
摘要
Abstract In this study, we successfully fabricated approximately 1 nm copper clusters on sulfur and nitrogen co‐doped graphite foam (SNGF) by using an electrodeposition method. The introduction of sulfur dopants enhances the metal‐support interaction and, thus, allows the application of the underpotential deposition (UPD) technique on graphite foam. Furthermore, the strong S−Cu binding leads to the preferential formation and firm anchoring of Cu nuclei on monodispersed S sites. The controllable growth of Cu nuclei into Cu clusters is achieved by controlling the deposition amount by adjusting the electrochemical parameters. As an example, the supported Cu clusters were utilized towards oxygen reduction reaction catalysis, exhibiting a high catalytic activity and a long‐term durability. Remarkably, this strategy is promising for developing a general method to prepare other metal clusters (e. g. Ag clusters).
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