传感器
超声波传感器
无损检测
压电
声学
材料科学
带宽(计算)
灵敏度(控制系统)
炸薯条
高分辨率
超声波检测
计算机科学
光学
电子工程
电信
工程类
物理
地质学
遥感
量子力学
作者
Jian‐xin Zhao,J. Hao,Dongdong Chen,Chunlong Fei,Zhaoxi Li,K. O. Chang,Zhipeng Zhang,Wanlong Qi,Changhong Li,Yintang Yang
标识
DOI:10.1038/s41598-025-93195-y
摘要
Focused high-frequency acoustic waves are utilized in industrial non-destructive testing (NDT) on account of their exceptional spatial resolution and high sensitivity. However, the majority of the focusing methods currently adopted for high-frequency transducers are mechanical pressure focusing and lens focusing, which may inflict mechanical damage on piezoelectric elements and give rise to low transmission efficiency. In this paper, an efficient approach to achieving self-focusing at high frequency is proposed. This is accomplished by utilizing half-concave piezoelectric elements. Through the employment of a precise micro-nano processing technology, a self-focusing half-concave ultrasonic transducer operating at a high frequency (62.7 MHz) was designed, fabricated, and characterized. This device exhibits excellent lateral resolution (39 μm) and a − 6 dB bandwidth (76.6%). The outstanding imaging performance was manifested using a multilayer circuit board and a chip. The results imply that the self-focusing half-concave high-frequency ultrasonic transducer has a prospective potential in industrial NDT, especially for defect detection in chip packaging.
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