钻石
铜
热导率
材料科学
复合材料
润湿
金刚石材料性能
电导率
冶金
化学
物理化学
作者
Kang Chen,Xuesong Leng,Rui Zhao,Yiyao Kang,Hongsheng Chen
出处
期刊:Crystals
[MDPI AG]
日期:2023-06-01
卷期号:13 (6): 906-906
标识
DOI:10.3390/cryst13060906
摘要
Copper-based diamond composites have been the focus of many investigations for higher thermal conductivity applications. However, the natural non-wetting behavior between diamond particles and copper matrix makes it difficult to fabricate copper-based diamond composites with high thermal conductivity. Thus, to promote wettability between copper and diamond particles, the copper/diamond interface must be modified by coating alloying elements on the diamond surface or by adding active alloying elements with carbon in the copper matrix. In this paper, we review the research progress on copper-based diamond composites, including theoretical models for calculating the thermal conductivity and the effect of process parameters on the thermal conductivity of copper-based diamond composites. The factors that affect interfacial thermal conductivity are emphatically analyzed in this review. Finally, the current problems of copper-based diamond composites and future research trends are recommended.
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