High-performance flexible nanocomposites with superior fire safety and ultra-efficient electromagnetic interference shielding

材料科学 复合材料 热塑性聚氨酯 纳米复合材料 韧性 电磁屏蔽 极限抗拉强度 电磁干扰 电磁干扰 热稳定性 弹性体 化学工程 电子工程 工程类
作者
Miao Liu,Kexin Chen,Yongqian Shi,Hengrui Wang,Shijie Wu,Ruizhe Huang,Yuezhan Feng,Long‐Cheng Tang,Xiaohuan Liu,Pingan Song
出处
期刊:Journal of Materials Science & Technology [Elsevier]
卷期号:166: 133-144 被引量:109
标识
DOI:10.1016/j.jmst.2023.05.017
摘要

High-performance multifunctional polymeric materials integrated with high fire safety, excellent mechanical performances and electromagnetic interference (EMI) shielding properties have great prospects in practical applications. However, designing highly fire-safe and mechanically robust EMI shielding nanocomposites remains a great challenge. Herein, hierarchical thermoplastic polyurethane/cyclophosphazene functionalized titanium carbide/carbon fiber fabric (TPU/CP-Ti3C2Tx/CF) nanocomposites with high fire safety and mechanical strength and toughness were prepared through the methods of melt blending, layer-by-layer stacking and thermocompression. The TPU/CP-Ti3C2Tx showed improved thermal stability. Moreover, the peak of heat release rate and total heat release of the hierarchical TPU sample containing 4.0 wt.% CP-Ti3C2Tx were respectively reduced by 64.4% and 31.8% relative to those of pure TPU, which were far higher than those of other TPU-based nanocomposites. The averaged EMI shielding effectiveness value of the hierarchical TPU/CP-Ti3C2Tx-2.0/CF nanocomposite reached 30.0 dB, which could satisfy the requirement for commercial applications. Furthermore, the tensile strength of TPU/CP-Ti3C2Tx-2.0/CF achieved 43.2 MPa, and the ductility and toughness increased by 28.4% and 84.3% respectively compared to those of TPU/CF. Interfacial hydrogen bonding in combination with catalytic carbonization of CP-Ti3C2Tx nanosheets and continuous conductive network of CF were responsible for the superior fire safety, excellent EMI shielding and outstanding mechanical performances. This work offers a promising strategy to prepare multifunctional TPU-based nanocomposites, which have the potential for large-scale application in the fields of electronics, electrical equipment and 5 G facilities.
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