Development of a classical force field for the oxidized Si surface: Application to hydrophilic wafer bonding

润湿 薄脆饼 吸附 化学物理 表面力 电荷密度 材料科学 分子 粘附 力场(虚构) 无定形固体 化学 复合材料 纳米技术 物理化学 机械 结晶学 有机化学 人工智能 计算机科学 物理 量子力学
作者
Daniel H. Cole,Mike C. Payne,Gábor Csányi,S.M. Spearing,Lucio Colombi Ciacchi
标识
DOI:10.1063/1.2799196
摘要

We have developed a classical two- and three-body interaction potential to simulate the hydroxylated, natively oxidized Si surface in contact with water solutions, based on the combination and extension of the Stillinger-Weber potential and of a potential originally developed to simulate SiO2 polymorphs. The potential parameters are chosen to reproduce the structure, charge distribution, tensile surface stress, and interactions with single water molecules of a natively oxidized Si surface model previously obtained by means of accurate density functional theory simulations. We have applied the potential to the case of hydrophilic silicon wafer bonding at room temperature, revealing maximum room temperature work of adhesion values for natively oxidized and amorphous silica surfaces of 97 and 90mJ∕m2, respectively, at a water adsorption coverage of approximately 1 ML. The difference arises from the stronger interaction of the natively oxidized surface with liquid water, resulting in a higher heat of immersion (203 vs 166mJ∕m2), and may be explained in terms of the more pronounced water structuring close to the surface in alternating layers of larger and smaller densities with respect to the liquid bulk. The computed force-displacement bonding curves may be a useful input for cohesive zone models where both the topographic details of the surfaces and the dependence of the attractive force on the initial surface separation and wetting can be taken into account.

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