PMUT公司
材料科学
超声波传感器
压电
晶片键合
薄脆饼
电容式微机械超声换能器
光电子学
微电子机械系统
中心频率
机电耦合系数
声学
电子工程
带通滤波器
复合材料
工程类
物理
作者
Ofer Rozen,Scott T. Block,Stefon E. Shelton,Richard J. Przybyla,David A. Horsley
标识
DOI:10.1109/memsys.2015.7051110
摘要
Air-coupled piezoelectric micromachined ultrasonic transducers (PMUTs) operating at frequencies ranging from 0.3 MHz to 0.9 MHz were designed, fabricated and characterized. We increased the fractional bandwidth by 51% and improved the piezoelectric coupling over 80% by patterning the diaphragm center into a ring or structural ribs, resulting in a reduction of the PMUT's mass. Pulse-echo testing was conducted in air using PMUTs at frequencies up to 0.9 MHz and the measured acoustic loss versus pathlength was compared to theoretical models. Devices were fabricated in an industrial foundry process using wafer-level bonding of a MEMS PMUT wafer to a CMOS wafer using a conductive metal eutectic bond. This process allows for close integration of PMUT arrays and signal processing circuitry and is used here to study the effects of wafer-level packaging on acoustic performance.
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