材料科学
电磁屏蔽
电磁干扰
复合材料
复合数
电磁干扰
极限抗拉强度
韧性
导电体
断裂韧性
消散
纳米纤维
纳米复合材料
增韧
断裂力学
堆积
作者
Hao Zhang,Jiaen Wang,Yali Zhang,Yuntong Meng,Yanhui Xue,Zhen Liu,Benliang Liang,Junwei Gu
摘要
ABSTRACT With the rapid development of 5G/6G communications and flexible intelligent equipment, electromagnetic interference (EMI) shielding materials are shifting from a sole pursuit of high shielding effectiveness toward structure–function integration. However, MXene‐based conductive composite films commonly suffer from trade‐offs between tensile strength and fracture toughness and between high conductive‐filler loading and structural durability, limiting their load‐bearing, deformation‐tolerant, and EMI shielding performance. Inspired by natural nacre, a synergistic biomimetic strategy is proposed by embedding three‐dimensional MoS 2 nanoflowers as multifunctional modifiers into a layered MXene/aramid nanofiber (ANF) framework to construct composite films. The hierarchical flower‐like morphology simultaneously regulates interlayer toughening and electromagnetic interfaces. At 9.1 wt.% MoS 2 , the film achieves 29.23 MJ m −3 toughness and 16.06% fracture strain, 2.18 and 1.96 times those of MXene/ANF films, while retaining 276.17 MPa strength and 43.1 dB EMI SE. At 23.1 wt.% MoS 2 , the X‐band EMI SE increases to 47.4 dB with 188.47 MPa strength. In situ tensile SEM and phase‐field finite element simulation reveal multidirectional interlayer sliding, tortuous crack deflection, and progressive interfacial energy dissipation as the key toughening mechanisms. The films also show stable electrothermal conversion, fire‐warning response, environmental tolerance, and low infrared emissivity, offering a design paradigm for flexible EMI shielding materials.
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