Integrated Microfluidic Cooling of Heterogeneous HBM–GPU Package With Die Height Difference
作者
Euichul Chung,Muhannad S. Bakir
出处
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology [Institute of Electrical and Electronics Engineers] 日期:2025-09-10卷期号:15 (11): 2429-2438