供应链                        
                
                                
                        
                            业务                        
                
                                
                        
                            产业组织                        
                
                                
                        
                            半导体器件制造                        
                
                                
                        
                            制造工程                        
                
                                
                        
                            工程类                        
                
                                
                        
                            计算机科学                        
                
                                
                        
                            营销                        
                
                                
                        
                            电气工程                        
                
                                
                        
                            薄脆饼                        
                
                        
                    
            作者
            
                Fu Jia,Daniel Hu,Tianyu Zhang,Lujie Chen,Ming‐Lang Tseng            
         
                    
        
    
            
            标识
            
                                    DOI:10.1080/00207543.2025.2568987
                                    
                                
                                 
         
        
                
            摘要
            
            The global semiconductor supply chain (SC) is both a pillar of the world economy and a focal point in the intensifying technological rivalry between China and the United States. This study examines its spatial configuration, specialisation patterns and the extent to which strategic competition is reshaping its structure and dynamics. Drawing on strategic trade theory, we propose a two-dimensional 'technology–market' framework and a three-dimensional 'support–suppress–reshape' policy lens to interpret the actions of both countries. Our analysis shows, first, that the semiconductor SC features pronounced specialisation: highly concentrated upstream segments and a fragmented downstream landscape. The US retains strong dominance upstream, while competition in midstream activities is gathering pace. Mainland China, by contrast, has cultivated advantages downstream. Second, the US is reinforcing its technological lead through the CHIPS and Science Act, domestic R&D subsidies and allied coordination to impose technology embargoes and market exclusion measures against China. In response, China is narrowing its technological gaps via the National Integrated Circuit Industry Development Fund, wide-ranging tax incentives across the SC and demand-side tools such as localised procurement, while using initiatives like the Belt and Road to expand in emerging markets. Finally, security concerns are accelerating SC regionalisation and deepening Sino–US technological decoupling.
         
            
 
                 
                
                    
                    科研通智能强力驱动
Strongly Powered by AbleSci AI