Progress and comparison in nondestructive detection, imaging and recognition technology for defects of wafers, chips and solder joints

As an essential part of integrated circuit, chip manufacturing has increasingly demanding requirements for quality, cost and others. Some technical limitations and the development direction of miniaturisation and high density have led to defects in the manufacturing process, which affect the performance and life of the chip. Therefore, the detection, identification and classification of defects are very important to improve the chip reliability. Based on the orderly and concise literature research, this paper focuses on a comprehensive review of the main research results in the field of non-contact non-destructive testing imaging methods for chip defects. Firstly, various defects that may occur in the chip design and packaging process are introduced. Then the contact detection methods including manual and probe method are clarified, and the principles, properties and development applications of NDT methods are introduced in detail, also the defect identification methods after imaging are briefly introduced. Moreover, the advantages and limitations of NDT technologies are summarised through comparative studies. Finally, the future development trend of non-destructive testing methods is predicted. This work hopes to provide some reference for the non-destructive testing of chips, which is of great significance for the health testing of chips in the electronics manufacturing industry.