Study of the Thermomechanical Behavior of Single-Crystal and Polycrystal Copper

This research paper presents an experimental, theoretical, and numerical study of the thermomechanical behavior of single-crystal and polycrystal copper under uniaxial stress compression loading at varying rates of deformation. The thermomechanical theory is based on a thermodynamically consistent framework for single-crystal face-centered cubic metals, and assumes that all plastic power is partitioned between stored energy due to dislocation structure evolution (configurational) and thermal (kinetic vibrational) energy. An expression for the Taylor–Quinney factor is proposed, which is a simple function of effective temperature and is allowed by second-law restrictions. This single-crystal model is used for the study of single- and polycrystal copper. New polycrystal thermomechanical experimental results are presented at varying strain rates. The temperature evolution on the surface of the polycrystal samples is measured using mounted thermocouples. Thermomechanical numerical single- and polycrystal simulations were performed for all experimental conditions ranging between 10−3 and 5 × 103 s−1. A Taylor homogenization model is used to represent polycrystal behavior. The numerical simulations of all conditions compare reasonable well with experimental results for both stress and temperature evolution. Given our lack of understanding of the mechanisms responsible for the coupling of dislocation glide and atomic vibration, this implies that the proposed theory is a reasonably accurate approximation of the single-crystal thermomechanics.