介电谱
材料科学
分层(地质)
相容性(地球化学)
复合材料
胶粘剂
食品包装
腐蚀
铝
箔法
阴极保护
电化学
电极
机械工程
化学
图层(电子)
古生物学
物理化学
工程类
生物
构造学
俯冲
标识
DOI:10.1080/02652039709374574
摘要
Food components migrating through organic layers are able to influence the adhesive properties of multilayer materials. In the case of coated metal substrates the interaction stability may be reduced by delamination and subsequent corrosion processes during storage. Impedance spectroscopy can be used to give a very early indication of a reduced interaction stability of a packaging material by measuring the delamination tendency. Applications are presented for laminated aluminium foil material. The delamination is induced by a cathodic treatment of samples prepared from the package. A comparison is made of material with no contact and with only a few days contact with the filled product. Main applications are foreseen as the replacement of long‐term storage tests to establish the compatibility of food and package material and to work out the specific influence of individual food components.
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