Research on Additives for Acid Copper Plating on Printed Circuit Boards

The electrochemical performances of each component of the additive(composed of SP,polyether,quaternary ammonium salt,etc.)used in throughhole plating were investigated in detail by linear sweep voltammetry,A.C.impedance and open circuit potential-time,and the covering power of the combined additive was also investigated at different temperatures with inner-hole method.It was found that the covering power of the additive is good. The through-hole plating power of the combined additive was also investigated by RDE simulation.