材料科学
电介质
基质(水族馆)
激光器
光电子学
制作
蚀刻(微加工)
图层(电子)
激光烧蚀
各向同性腐蚀
微电子
光学
复合材料
物理
地质学
病理
海洋学
替代医学
医学
作者
Sooraj Shiby,Yugandhara Rao Yadam,Balamurugan T. Sivaprakasam,Kavitha Arunachalam,Nilesh J. Vasa
摘要
Micro-scale removal of Cu from a dielectric substrate has applications in microelectronics, patch antenna fabrication and frequency selective surface (FSS) manufacturing. Pulsed laser-based micro-scribing of Copper (Cu) from a dielectric is a preferred technique to avoid the adverse effects of chemical etching, such as toxicity and corrosive nature of the etchant, difficulty in fabrication of mask etc. However, pulsed laser-assisted removal of Cu from a dielectric in the air will produce recast layer/ redeposit, oxide layer near the ablation zone and thermal damage to the dielectric is another challenge. In this study, a hybrid technique with nanosecond laser-activated electrochemical micro-scribing of Cu is demonstrated. The technique was extended to remove 35 μm Cu from Rogers-RO4003 dielectric with a thickness ≈0.75 mm to fabricate FSS samples in X-band. The Cu-deposited dielectric substrate was immersed in Sodium Chloride (NaCl) solution, the laser beam was directed through a negatively biased tool electrode and the sample was biased positively. In this hybrid technique, along with laser-assisted material removal, laser-activated electrochemical etching also removed Cu selectively. The laser irradiation coupled with the NaCl solution induced preferential micro-etching, resulting in improved surface morphology without re-deposition and recast layer and thermal protection to the dielectric substrate. The FSS sample produced with the laser-hybrid micro-scribing was working at 10.3 GHz.
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